The Europe semiconductor bonding market is expected to grow from US$ 215.77 million in 2022 to US$ 349.17 million by 2028. It is estimated to grow at a CAGR of 8.4% from 2022 to 2028.
Segments Covered
Europe Semiconductor Bonding Market: By Type
Die Bonder
Wafer Bonder
Flip Chip Bonder
Europe Semiconductor Bonding Market: By Application
RF Devices
MEMS and Sensors
LED
CMOS Image Sensors
3D NAND
Europe Semiconductor Bonding Market Segmentation
The Europe semiconductor bonding market is segmented into type, application, and country. Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022. Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022. Based on country, the market is segmented into Germany, France, Italy, Russia, the UK, and rest of Europe. Germany dominated the market share in 2022.
ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Europe region.
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Europe Semiconductor Bonding Report Scope
Report Attribute Details
Market size in 2022 US$ 215.77 Million
Market Size by 2028 US$ 349.17 Million
Global CAGR (2022 – 2028) 8.4%
Historical Data 2020-2021
Forecast period 2023-2028
Rising Adoption of Stacked Die Technology in IoT Devices
- The demand for enhanced functionality within the limited space of IoT device PCBs is driving the adoption of stacked die technology. This adoption is a key factor in the Europe semiconductor bonding market.
- Vertical stacking of chips or the use of spacers allows for better space utilization.
- Assembly limitations with compact rigid and rigid-flex circuits are increasing the appeal of stacked die in IoT. This appeal is driving the Europe semiconductor bonding market.
- Stacked die technology simplifies semiconductor design and results in smaller end products, a key advantage for handheld and tracking IoT devices. The bonding of these smaller products impacts the Europe semiconductor bonding market.
- The continuous push for smaller handheld electronic devices is a significant factor in the advancement of stacked die techniques.
- Implementing stacked die helps to decrease design complexity and improve the likelihood of first-pass success. The growing demand for semiconductor bonding solutions is a driver for the Europe semiconductor bonding market.
- The growing use of stacked die in IoT devices is increasing the demand for semiconductor bonding solutions.
- Semiconductor OEMs are exploiting the advantages of IoT beyond simple connectivity.
- The utilization of various IoT devices is expanding across numerous industries.
- Semiconductor bonding methods are critical for the compact attachment of stacked dies in IoT devices.
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